Assignee
INTERCONNECT PORTFOLIO LLC
US·12 granted patents·3 pending applications·329 citations·filing 2004–2010
Top patents by PatentIndex Score
15 records- 0198US7737545B2Multi-surface IC packaging structures and methods for their manufactureINTERCONNECT PORTFOLIO LLC·Filed 2006·Granted Jun 15, 2010·102 cites·22 claims
- 0296US7652381B2Interconnect system without through-holesINTERCONNECT PORTFOLIO LLC·Filed 2005·Granted Jan 26, 2010·52 cites·28 claims
- 0396US7651382B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrityINTERCONNECT PORTFOLIO LLC·Filed 2008·Granted Jan 26, 2010·60 cites·14 claims
- 0496US7613011B2Signal-segregating connector systemINTERCONNECT PORTFOLIO LLC·Filed 2007·Granted Nov 3, 2009·45 cites·15 claims
- 0587US7909615B1Torsionally-induced contact-force conductors for electrical connector systemsINTERCONNECT PORTFOLIO LLC·Filed 2010·Granted Mar 22, 2011·11 cites·2 claims
- 0685US7750446B2IC package structures having separate circuit interconnection structures and assemblies constructed thereofINTERCONNECT PORTFOLIO LLC·Filed 2005·Granted Jul 6, 2010·13 cites·41 claims
- 0784US7651336B2High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureINTERCONNECT PORTFOLIO LLC·Filed 2007·Granted Jan 26, 2010·9 cites·26 claims
- 0880US7845986B2Torsionally-induced contact-force conductors for electrical connector systemsINTERCONNECT PORTFOLIO LLC·Filed 2005·Granted Dec 7, 2010·13 cites·7 claims
- 0978US7388279B2Tapered dielectric and conductor structures and applications thereofINTERCONNECT PORTFOLIO LLC·Filed 2004·Granted Jun 17, 2008·22 cites·6 claims
- 1061US7404746B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrityINTERCONNECT PORTFOLIO LLC·Filed 2006·Granted Jul 29, 2008·1 cites·20 claims
- 1147US2010289130A1Method and Apparatus for Vertical Stacking of Integrated Circuit ChipsINTERCONNECT PORTFOLIO LLC·Filed 2009·Application pending·0 cites
- 1245US2010127402A1Interconnect System without Through-HolesINTERCONNECT PORTFOLIO LLC·Filed 2010·Application pending·0 cites
- 1344US7732904B2Multi-surface contact IC packaging structures and assembliesINTERCONNECT PORTFOLIO LLC·Filed 2004·Granted Jun 8, 2010·1 cites·29 claims
- 1442US7701323B1Low profile discrete electronic components and applications of sameINTERCONNECT PORTFOLIO LLC·Filed 2004·Granted Apr 20, 2010·0 cites·17 claims
- 1538US2010258952A1Interconnection of IC Chips by Flex Circuit SuperstructureINTERCONNECT PORTFOLIO LLC·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →