Assignee
INTEGRATED PACKAGING ASSEMBLY
US·8 granted patents·102 citations·filing 1993–1998
Top patents by PatentIndex Score
8 records- 0172US5766535APressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuitsINTEGRATED PACKAGING ASSEMBLY·Filed 1997·Granted Jun 16, 1998·44 cites·7 claims
- 0254US5436407AMetal semiconductor package with an external plastic sealINTEGRATED PACKAGING ASSEMBLY·Filed 1994·Granted Jul 25, 1995·21 cites·14 claims
- 0344US6058602AMethod for encapsulating IC packages with diamond substrateINTEGRATED PACKAGING ASSEMBLY·Filed 1998·Granted May 9, 2000·11 cites·6 claims
- 0437US5452635AApparatus for integrated circuit lead-frame punchingINTEGRATED PACKAGING ASSEMBLY·Filed 1993·Granted Sep 26, 1995·8 cites·4 claims
- 0535US5491110AMetal semiconductor package with an external plastic sealINTEGRATED PACKAGING ASSEMBLY·Filed 1995·Granted Feb 13, 1996·6 cites·13 claims
- 0634US5495780AMethod for sharpening an IC lead-frame punchINTEGRATED PACKAGING ASSEMBLY·Filed 1995·Granted Mar 5, 1996·5 cites·5 claims
- 0730US6269723B1Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal systemINTEGRATED PACKAGING ASSEMBLY·Filed 1997·Granted Aug 7, 2001·4 cites·8 claims
- 0830US5497681AMethod for making an IC lead-frame punchINTEGRATED PACKAGING ASSEMBLY·Filed 1995·Granted Mar 12, 1996·3 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →