Assignee

INT PACKAGING AND ASSEMBLY COR

US·2 granted patents·84 citations·filing 1996–1997

Technology mixH10W2

Top patents by PatentIndex Score

2 records

0178US5872395ABent tip method for preventing vertical motion of heat spreaders during injection molding of IC packagesINT PACKAGING AND ASSEMBLY COR·Filed 1996·Granted Feb 16, 1999·71 cites·8 claims
0243US5859477AApparatus for encapsulating IC packages with diamond substrate thermal conductorINT PACKAGING AND ASSEMBLY COR·Filed 1997·Granted Jan 12, 1999·13 cites·9 claims

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