Assignee
INADA TEIICHI
JP·2 granted patents·8 pending applications·21 citations·filing 2004–2012
Top patents by PatentIndex Score
10 records- 0194US8617930B2Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2012·Granted Dec 31, 2013·19 cites·13 claims
- 0285US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0353US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 0452US2008171187A1Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2008·Application pending·0 cites
- 0550US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 0648US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 0747US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 0847US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 0943US2011287250A1Adhesive sheet, semiconductor device, and process for producing semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1040US2006128065A1Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing methodINADA TEIICHI·Filed 2004·Application pending·0 cites
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