Assignee
IKEGUCHI NOBUYUKI
KR·2 granted patents·1 pending application·7 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0178US8174128B2Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip methodIKEGUCHI NOBUYUKI·Filed 2010·Granted May 8, 2012·5 cites·18 claims
- 0273US9211592B2Lubricant sheet for drilling and method of drillingIKEGUCHI NOBUYUKI·Filed 2008·Granted Dec 15, 2015·2 cites·10 claims
- 0344US2012174393A1Method of fabricating multilayered printed circuit boardIKEGUCHI NOBUYUKI·Filed 2012·Application pending·0 cites
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