Assignee
ICEOTOPE GROUP LTD
GB·18 granted patents·9 pending applications·129 citations·filing 2018–2025
Top patents by PatentIndex Score
27 records- 0196US11778790B2Fluid cooling systemICEOTOPE GROUP LTD·Filed 2022·Granted Oct 3, 2023·8 cites·3 claims
- 0296US11737247B2Fluid cooling systemICEOTOPE GROUP LTD·Filed 2021·Granted Aug 22, 2023·9 cites·15 claims
- 0395US11968802B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2023·Granted Apr 23, 2024·4 cites·11 claims
- 0495US11653472B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2022·Granted May 16, 2023·9 cites·4 claims
- 0595US11596082B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2022·Granted Feb 28, 2023·6 cites·22 claims
- 0695US11470739B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2021·Granted Oct 11, 2022·12 cites·14 claims
- 0795US11369040B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2021·Granted Jun 21, 2022·8 cites·9 claims
- 0895US11096313B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2018·Granted Aug 17, 2021·33 cites·17 claims
- 0994US11963338B2Cooling system for electronic modulesICEOTOPE GROUP LTD·Filed 2022·Granted Apr 16, 2024·10 cites·16 claims
- 1094US11490546B2Cooling system for electronic modulesICEOTOPE GROUP LTD·Filed 2021·Granted Nov 1, 2022·18 cites·18 claims
- 1192US11917796B2Heat sink for liquid coolingICEOTOPE GROUP LTD·Filed 2020·Granted Feb 27, 2024·4 cites·16 claims
- 1290US12096595B2Cold plate and system for cooling electronic devicesICEOTOPE GROUP LTD·Filed 2020·Granted Sep 17, 2024·3 cites·20 claims
- 1387US11980011B2Cold plateICEOTOPE GROUP LTD·Filed 2020·Granted May 7, 2024·5 cites·20 claims
- 1486US2026040492A1Nozzle arrangement and cooling moduleICEOTOPE GROUP LTD·Filed 2025·Application pending·0 cites
- 1579US12538451B2Heat sink, heat sink arrangement and module for liquid immersion coolingICEOTOPE GROUP LTD·Filed 2023·Granted Jan 27, 2026·0 cites·9 claims
- 1668US2024196572A1Heat sink for liquid coolingICEOTOPE GROUP LTD·Filed 2024·Application pending·0 cites
- 1763US12446186B2Nozzle arrangement and cooling moduleICEOTOPE GROUP LTD·Filed 2020·Granted Oct 14, 2025·0 cites·16 claims
- 1857US12575058B2Dielectric coolant distribution manifoldICEOTOPE GROUP LTD·Filed 2021·Granted Mar 10, 2026·0 cites·19 claims
- 1954US2025169030A1Apparatus and system for cooling electronic devicesICEOTOPE GROUP LTD·Filed 2023·Application pending·0 cites
- 2053US12510941B2Cooling moduleICEOTOPE GROUP LTD·Filed 2020·Granted Dec 30, 2025·0 cites·10 claims
- 2151US2026059713A1High thermal capacity heat sinkICEOTOPE GROUP LTD·Filed 2023·Application pending·0 cites
- 2251US2025176131A1Two-stage cooling of heat generating componentsICEOTOPE GROUP LTD·Filed 2023·Application pending·0 cites
- 2348US12538452B2System for cooling electronic devices in an electronic moduleICEOTOPE GROUP LTD·Filed 2021·Granted Jan 27, 2026·0 cites·14 claims
- 2442US2022151112A1Cooling module and cooling module rackICEOTOPE GROUP LTD·Filed 2020·Application pending·0 cites
- 2542US2023083799A1Housing for immersive liquid cooling of multiple electronic devicesICEOTOPE GROUP LTD·Filed 2021·Application pending·0 cites
- 2641US2022201896A1Cooling system for electronic modulesICEOTOPE GROUP LTD·Filed 2020·Application pending·0 cites
- 2738US2024008220A1Heat sink arrangementICEOTOPE GROUP LTD·Filed 2021·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →