Assignee
ICEMOS TECHNOLOGY CORP
US·3 granted patents·4 pending applications·40 citations·filing 2006–2007
Top patents by PatentIndex Score
7 records- 0193US7446018B2Bonded-wafer superjunction semiconductor deviceICEMOS TECHNOLOGY CORP·Filed 2006·Granted Nov 4, 2008·33 cites·18 claims
- 0282US7429772B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY CORP·Filed 2006·Granted Sep 30, 2008·6 cites·9 claims
- 0365US7439178B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY CORP·Filed 2007·Granted Oct 21, 2008·1 cites·11 claims
- 0448US2008099924A1Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 0544US2008272429A1Superjunction devices having narrow surface layout of terminal structures and methods of manufacturing the devicesICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 0643US2008122040A1Varying Pitch Adapter and a Method of Forming a Varying Pitch AdapterICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 0737US2009026586A1Superjunction Device Having Oxide Lined Trenches and Method for Manufacturing a Superjunction Device Having Oxide Lined TrenchesICEMOS TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
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