Assignee
IANG JR-JUNG
TW·2 granted patents·17 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0180US8734751B2Method and apparatus for recycling and treating wastes of silicon wafer cutting and polishing processesIANG JR-JUNG·Filed 2011·Granted May 27, 2014·12 cites·9 claims
- 0275US8480905B2Method and system for recycling and treating dyeing wastewaterIANG JR-JUNG·Filed 2011·Granted Jul 9, 2013·5 cites·10 claims
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