Assignee
HYMITE AS
DK·26 granted patents·1 pending application·671 citations·filing 2000–2009
Top patents by PatentIndex Score
27 records- 0197US6818464B2Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holesHYMITE AS·Filed 2002·Granted Nov 16, 2004·154 cites·14 claims
- 0295US7531445B2Formation of through-wafer electrical interconnections and other structures using a thin dielectric membraneHYMITE AS·Filed 2007·Granted May 12, 2009·35 cites·10 claims
- 0395US7528422B2Package for a light emitting element with integrated electrostatic discharge protectionHYMITE AS·Filed 2006·Granted May 5, 2009·46 cites·17 claims
- 0494US7419853B2Method of fabrication for chip scale package for a micro componentHYMITE AS·Filed 2005·Granted Sep 2, 2008·37 cites·6 claims
- 0593US7662710B2Formation of through-wafer electrical interconnections and other structures using a thin dielectric membraneHYMITE AS·Filed 2009·Granted Feb 16, 2010·26 cites·11 claims
- 0693US6856717B2Package with a light emitting deviceHYMITE AS·Filed 2003·Granted Feb 15, 2005·70 cites·34 claims
- 0790US7467897B2Light transmitting modules with optical power monitoringHYMITE AS·Filed 2006·Granted Dec 23, 2008·25 cites·9 claims
- 0890US6969204B2Optical package with an integrated lens and optical assemblies incorporating the packageHYMITE AS·Filed 2002·Granted Nov 29, 2005·49 cites·35 claims
- 0988US6786654B2Encapsulated optical fiber end-coupled deviceHYMITE AS·Filed 2002·Granted Sep 7, 2004·42 cites·36 claims
- 1086US7057274B2Semiconductor structures having through-holes sealed with feed-through metalizationHYMITE AS·Filed 2004·Granted Jun 6, 2006·34 cites·10 claims
- 1182US7543999B2Optical module hermetically packaged in micro-machined structuresHYMITE AS·Filed 2005·Granted Jun 9, 2009·12 cites·29 claims
- 1281US7732829B2Optoelectronic device submountHYMITE AS·Filed 2008·Granted Jun 8, 2010·10 cites·37 claims
- 1376US7165896B2Light transmitting modules with optical power monitoringHYMITE AS·Filed 2004·Granted Jan 23, 2007·23 cites·13 claims
- 1476US6832013B1Hybrid integration of active and passive optical components on an Si-boardHYMITE AS·Filed 2000·Granted Dec 14, 2004·25 cites·8 claims
- 1575US7553695B2Method of fabricating a package for a micro componentHYMITE AS·Filed 2005·Granted Jun 30, 2009·8 cites·16 claims
- 1671US7253388B2Assembly with self-alignment features to position a cover on a substrate that supports a micro componentHYMITE AS·Filed 2004·Granted Aug 7, 2007·16 cites·17 claims
- 1769US7415180B2Accurate positioning of components of an optical assemblyHYMITE AS·Filed 2007·Granted Aug 19, 2008·5 cites·11 claims
- 1868US7213978B2Optical device receiving substrate and optical device holding carrierHYMITE AS·Filed 2003·Granted May 8, 2007·15 cites·30 claims
- 1963US7732234B2Fabrication process for package with light emitting device on a sub-mountHYMITE AS·Filed 2007·Granted Jun 8, 2010·3 cites·36 claims
- 2062US7388285B2Hermetically sealed package for optical, electronic, opto-electronic and other devicesHYMITE AS·Filed 2006·Granted Jun 17, 2008·3 cites·20 claims
- 2162US7109580B2Hermetically sealed package for optical, electronic, opto-electronic and other devicesHYMITE AS·Filed 2004·Granted Sep 19, 2006·14 cites·15 claims
- 2260US7470622B2Fabrication and use of polished silicon micro-mirrorsHYMITE AS·Filed 2005·Granted Dec 30, 2008·2 cites·18 claims
- 2356US7081412B2Double-sided etching technique for semiconductor structure with through-holesHYMITE AS·Filed 2004·Granted Jul 25, 2006·5 cites·14 claims
- 2455US7732240B2Formation of through-wafer electrical interconnections and other structures using a thin dielectric membraneHYMITE AS·Filed 2009·Granted Jun 8, 2010·0 cites·7 claims
- 2555US7209235B2Accurate positioning of components of a optical assemblyHYMITE AS·Filed 2003·Granted Apr 24, 2007·5 cites·13 claims
- 2653US7681306B2Method of forming an assembly to house one or more micro componentsHYMITE AS·Filed 2004·Granted Mar 23, 2010·7 cites·29 claims
- 2742US2010176507A1Semiconductor-based submount with electrically conductive feed-throughsHYMITE AS·Filed 2009·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →