Assignee
HWANG DONG WEON
16 granted patents·3 pending applications·96 citations·filing 2005–2024
Top patents by PatentIndex Score
19 records- 0195US10466273B1Socket device for testing ICHWANG DONG WEON·Filed 2018·Granted Nov 5, 2019·25 cites·8 claims
- 0293US8808038B2Spring contact and a socket embedded with spring contactsHWANG DONG WEON·Filed 2010·Granted Aug 19, 2014·19 cites·22 claims
- 0386US7601018B2BGA-type test and burn-in socket for integrated circuits (ICs)HWANG DONG WEON·Filed 2006·Granted Oct 13, 2009·16 cites·16 claims
- 0485US8715015B2Structure for a spring contactHWANG DONG WEON·Filed 2011·Granted May 6, 2014·17 cites·37 claims
- 0585US7874863B1Test and burn-in socket for integrated circuits (ICs)HWANG DONG WEON·Filed 2010·Granted Jan 25, 2011·6 cites·2 claims
- 0684US7828575B2Test and burn-in socket for integrated circuits (ICS)HWANG DONG WEON·Filed 2005·Granted Nov 9, 2010·8 cites·2 claims
- 0780US7918679B2Test and burn-in socket for integrated circuits (ICs)HWANG DONG WEON·Filed 2010·Granted Apr 5, 2011·4 cites·3 claims
- 0870US11486896B2Contact and test socket device for testing semiconductor deviceHWANG DONG WEON·Filed 2021·Granted Nov 1, 2022·0 cites·10 claims
- 0970US11486897B2Contact and test socket device for testing semiconductor deviceHWANG DONG WEON·Filed 2021·Granted Nov 1, 2022·0 cites·10 claims
- 1068US12392798B2Socket device for testing ICSHWANG DONG WEON·Filed 2023·Granted Aug 19, 2025·0 cites·8 claims
- 1162US10241132B2Socket apparatus for semiconductor device testHWANG DONG WEON·Filed 2015·Granted Mar 26, 2019·1 cites·20 claims
- 1260US10935572B2Contact and test socket device for testing semiconductor deviceHWANG DONG WEON·Filed 2017·Granted Mar 2, 2021·0 cites·15 claims
- 1357US2024230715A1SOCKET DEVICE FOR TESTING ICsHWANG DONG WEON·Filed 2024·Application pending·0 cites
- 1457US2024230716A1SOCKET DEVICE FOR TESTING ICsHWANG DONG WEON·Filed 2024·Application pending·0 cites
- 1556US2024069607A1Memory module socketHWANG DONG WEON·Filed 2023·Application pending·0 cites
- 1654US12061212B2Spring contact and socket having spring contact embedded thereinHWANG DONG WEON·Filed 2019·Granted Aug 13, 2024·0 cites·10 claims
- 1751US10761110B2Contact for testing semiconductor device, and test socket device thereforHWANG DONG WEON·Filed 2018·Granted Sep 1, 2020·0 cites·28 claims
- 1850US10971843B2BGA socket device for testing BGA ICHWANG DONG WEON·Filed 2019·Granted Apr 6, 2021·0 cites·17 claims
- 1947US10955438B2Contact and socket device for testing semiconductorHWANG DONG WEON·Filed 2018·Granted Mar 23, 2021·0 cites·16 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →