Assignee
HWANG CHI-WON
JP·1 granted patent·2 pending applications·11 citations·filing 2007–2009
Top patents by PatentIndex Score
3 records- 0180US8391016B2Carbon nanotube-reinforced solder caps, and chip packages and systems containing sameHWANG CHI-WON·Filed 2009·Granted Mar 5, 2013·11 cites·16 claims
- 0244US2009057378A1In-situ chip attachment using self-organizing solderHWANG CHI-WON·Filed 2007·Application pending·0 cites
- 0341US2017004978A1Methods of forming high density metal wiring for fine line and space packaging applications and structures formed therebyHWANG CHI-WON·Filed 2007·Application pending·0 cites
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