Assignee
HU WEN-HUNG
TW·3 granted patents·5 pending applications·6 citations·filing 2006–2012
Top patents by PatentIndex Score
8 records- 0168US8058564B2Circuit board surface structureHU WEN-HUNG·Filed 2008·Granted Nov 15, 2011·4 cites·11 claims
- 0257US8188377B2Circuit board having electrically connecting structure and fabrication method thereofHU WEN-HUNG·Filed 2008·Granted May 29, 2012·2 cites·3 claims
- 0348US2006202331A1Conductive bump structure of circuit board and method for fabricating the sameHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 0446US8269354B2Semiconductor package substrate structure and manufacturing method thereofHU WEN-HUNG·Filed 2010·Granted Sep 18, 2012·0 cites·6 claims
- 0543US2006225917A1Conductive bump structure of circuit board and fabrication method thereofHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 0643US2006252248A1Method for fabricating electrically connecting structure of circuit boardHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 0743US2006219567A1Fabrication method of conductive bump structures of circuit boardHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 0834US2012255771A1Packaging substrate and method of fabricating the sameHU WEN-HUNG·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →