Assignee
HU CHUAN
US·11 granted patents·4 pending applications·89 citations·filing 2005–2014
Top patents by PatentIndex Score
15 records- 0197US9281292B2Single layer low cost wafer level packaging for SFF SiPHU CHUAN·Filed 2012·Granted Mar 8, 2016·54 cites·20 claims
- 0287US9685390B2Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layerHU CHUAN·Filed 2012·Granted Jun 20, 2017·9 cites·7 claims
- 0387US9072187B2Off-plane conductive line interconnects in microelectronic devicesHU CHUAN·Filed 2012·Granted Jun 30, 2015·9 cites·16 claims
- 0481US8424748B2Solder in cavity interconnection technologyHU CHUAN·Filed 2009·Granted Apr 23, 2013·8 cites·19 claims
- 0573US9006890B2Solder in cavity interconnection structuresHU CHUAN·Filed 2013·Granted Apr 14, 2015·2 cites·7 claims
- 0672US9741645B2Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packagesHU CHUAN·Filed 2011·Granted Aug 22, 2017·3 cites·18 claims
- 0766US8080870B2Die-warpage compensation structures for thinned-die devices, and methods of assembling sameHU CHUAN·Filed 2009·Granted Dec 20, 2011·3 cites·28 claims
- 0863US8872355B2Semiconductor device with pre-molding chip bondingHU CHUAN·Filed 2012·Granted Oct 28, 2014·1 cites·6 claims
- 0957US2013206820A1Solder in cavity interconnection technologyHU CHUAN·Filed 2013·Application pending·0 cites
- 1056US9659885B2Semiconductor device with pre-molding chip bondingHU CHUAN·Filed 2014·Granted May 23, 2017·0 cites·11 claims
- 1151US8936967B2Solder in cavity interconnection structuresHU CHUAN·Filed 2011·Granted Jan 20, 2015·0 cites·9 claims
- 1250US10096535B2Packaged semiconductor die and CTE-engineering die pairHU CHUAN·Filed 2011·Granted Oct 9, 2018·0 cites·24 claims
- 1345US2009166852A1Semiconductor packages with thermal interface materialsHU CHUAN·Filed 2007·Application pending·0 cites
- 1443US2008142954A1Multi-chip package having two or more heat spreadersHU CHUAN·Filed 2006·Application pending·0 cites
- 1537US2007004216A1Formation of assemblies with a diamond heat spreaderHU CHUAN·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →