Assignee
HSU SHIH-PING
TW·16 granted patents·21 pending applications·67 citations·filing 2005–2012
Top patents by PatentIndex Score
37 records- 0186US8227711B2Coreless packaging substrate and method for fabricating the sameHSU SHIH-PING·Filed 2010·Granted Jul 24, 2012·7 cites·14 claims
- 0285US8829356B2Packaging substrate having a passive element embedded therein and method of fabricating the sameHSU SHIH-PING·Filed 2011·Granted Sep 9, 2014·7 cites·7 claims
- 0384US8058105B2Method of fabricating a packaging structureHSU SHIH-PING·Filed 2010·Granted Nov 15, 2011·7 cites·7 claims
- 0482US8110896B2Substrate structure with capacitor component embedded therein and method for fabricating the sameHSU SHIH-PING·Filed 2006·Granted Feb 7, 2012·10 cites·4 claims
- 0582US8101866B2Packaging substrate with conductive structureHSU SHIH-PING·Filed 2008·Granted Jan 24, 2012·10 cites·17 claims
- 0677US8399778B2Circuit board structure and fabrication method thereofHSU SHIH-PING·Filed 2008·Granted Mar 19, 2013·6 cites·4 claims
- 0776US8058566B2Packaging substrate structure and manufacturing method thereofHSU SHIH-PING·Filed 2008·Granted Nov 15, 2011·6 cites·14 claims
- 0874US8711572B2Circuit board having semiconductor chip embedded thereinHSU SHIH-PING·Filed 2012·Granted Apr 29, 2014·3 cites·13 claims
- 0973US9179549B2Packaging substrate having embedded passive component and fabrication method thereofHSU SHIH-PING·Filed 2010·Granted Nov 3, 2015·3 cites·7 claims
- 1066US8058718B2Package substrate embedded with semiconductor componentHSU SHIH-PING·Filed 2008·Granted Nov 15, 2011·3 cites·11 claims
- 1164US8436463B2Packaging substrate structure with electronic component embedded therein and method for manufacture of the sameHSU SHIH-PING·Filed 2008·Granted May 7, 2013·2 cites·7 claims
- 1260US8058721B2Package structureHSU SHIH PING·Filed 2009·Granted Nov 15, 2011·1 cites·8 claims
- 1359US8070932B2Circuit board with identifiable information and method for fabricating the sameHSU SHIH-PING·Filed 2008·Granted Dec 6, 2011·1 cites·15 claims
- 1455US8610006B2Lid for micro-electro-mechanical device and method for fabricating the sameHSU SHIH-PING·Filed 2009·Granted Dec 17, 2013·1 cites·3 claims
- 1551US2006223230A1Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the sameHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 1649US8633587B2Package structureHSU SHIH-PING·Filed 2011·Granted Jan 21, 2014·0 cites·8 claims
- 1748US2008023821A1Substrate structure integrated with passive componentsHSU SHIH-PING·Filed 2007·Application pending·0 cites
- 1848US2008024998A1Substrate structure integrated with passive componentsHSU SHIH-PING·Filed 2007·Application pending·0 cites
- 1947US2007181995A1Circuit board structure embedded with semiconductor chipsHSU SHIH PING·Filed 2006·Application pending·0 cites
- 2047US2007216019A1Laminated ic packaging substrate and inter-connector structure thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2147US2012104598A1Package structure having embedded semiconductor component and fabrication method thereofHSU SHIH-PING·Filed 2011·Application pending·0 cites
- 2247US2007051533A1Optical electronics integrated semiconductor packageHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2347US2007186413A1Circuit board structure and method for fabricating the sameHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2447US2008083819A1Repaired pre-soldering structure of circuit board and method thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2546US2006157852A1Circuit barrier structure of semiconductor packaging substrate and method for fabricating the sameHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2646US2007281464A1Multi-layer circuit board with fine pitches and fabricating method thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2744US2006252247A1Processing apparatus for electroplating conductive bumps on organic circuit boardHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2843US8779300B2Packaging substrate with conductive structureHSU SHIH-PING·Filed 2012·Granted Jul 15, 2014·0 cites·17 claims
- 2943US2008006936A1Superfine-circuit semiconductor package structureHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 3043US2007114647A1Carrier board structure with semiconductor chip embedded thereinHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 3142US2006157867A1Flip-chip package structure with direct electrical connection of semiconductor chipHSU SHIH-PING·Filed 2005·Application pending·0 cites
- 3242US2013313002A1Multilayer printed circuit board and method for manufacturing sameHSU SHIH-PING·Filed 2012·Application pending·0 cites
- 3342US2006145328A1Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the sameHSU SHIH-PING·Filed 2005·Application pending·0 cites
- 3441US2008083115A1Method for repairing metal finish layer on surface of electrical connection pad of circuit boardHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 3541US2006252249A1Solder ball pad surface finish structure of circuit board and fabrication method thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 3639US2007144774A1Circuit board assembly with fine electrically connecting structureHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 3738US2006273816A1Circuit board having a reverse build-up structureHSU SHIH-PING·Filed 2006·Application pending·0 cites
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