Assignee
HSU HSIN HUI
TW·6 granted patents·3 citations·filing 2009–2015
Top patents by PatentIndex Score
6 records- 0178US8829628B2MEMS package structureHSU HSIN-HUI·Filed 2012·Granted Sep 9, 2014·2 cites·5 claims
- 0258US9018718B2Micro-electro-mechanical-system device with guard ring and method for making sameHSU HSIN HUI·Filed 2009·Granted Apr 28, 2015·1 cites·4 claims
- 0352US8729660B2MEMS integrated chip with cross-area interconnectionHSU HSIN-HUI·Filed 2011·Granted May 20, 2014·0 cites·3 claims
- 0452US8704331B2MEMS integrated chip with cross-area interconnectionHSU HSIN-HUI·Filed 2011·Granted Apr 22, 2014·0 cites·12 claims
- 0552US8247253B2MEMS package structure and method for fabricating the sameHSU HSIN-HUI·Filed 2010·Granted Aug 21, 2012·0 cites·6 claims
- 0648US9302907B2Micro-electro-mechanical-system device with guard ring and method for making sameHSU HSIN HUI·Filed 2015·Granted Apr 5, 2016·0 cites·5 claims
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