Assignee
HPSP CO LTD
KR·0 granted patents·22 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
22 records- 0175US2025014928A1High-pressure wafer processing method using dual high-pressure wafer processing facilityHPSP CO LTD·Filed 2024·Application pending·0 cites
- 0268US2025149351A1High-pressure wafer processing method using dual high-pressure wafer processing facilityHPSP CO LTD·Filed 2023·Application pending·0 cites
- 0365US2026016231A1Gas management assembly for substrate processing apparatusHPSP CO LTD·Filed 2024·Application pending·0 cites
- 0462US2025051916A1High-pressure substrate processing apparatus and high-pressure chemical vapor deposition method for substrate using sameHPSP CO LTD·Filed 2024·Application pending·0 cites
- 0561US2025142826A1Method for manufacturing three-dimensional nand flash memory arrayHPSP CO LTD·Filed 2024·Application pending·0 cites
- 0661US2025105027A1High pressure gaseous hydrogen oxide providing device, and high pressure substrate processing apparatus and method using the sameHPSP CO LTD·Filed 2024·Application pending·0 cites
- 0755US2025054771A1Method for doping carbon in thin film on waferHPSP CO LTD·Filed 2022·Application pending·0 cites
- 0855US2025105003A1Insulation film manufacturing method of semiconductor processHPSP CO LTD·Filed 2023·Application pending·0 cites
- 0954US2025203915A1Semiconductor device and method for manufacturing semiconductor deviceHPSP CO LTD·Filed 2023·Application pending·0 cites
- 1051US2025187021A1High pressure substrate processing apparatusHPSP CO LTD·Filed 2023·Application pending·0 cites
- 1149US2025236949A1High pressure substrate processing apparatus and cold trap used thereforHPSP CO LTD·Filed 2025·Application pending·0 cites
- 1243US2023194174A1Gas management assembly for high pressure heat-treatment apparatusHPSP CO LTD·Filed 2022·Application pending·0 cites
- 1341US2024339338A1Wafer processing apparatus for combined high-pressure process and vacuum process, and wafer processing method using decompressionHPSP CO LTD·Filed 2024·Application pending·0 cites
- 1437US2024096662A1High pressure processing apparatusHPSP CO LTD·Filed 2023·Application pending·0 cites
- 1537US2024096661A1Gas box assembly for high pressure processing apparatusHPSP CO LTD·Filed 2023·Application pending·0 cites
- 1637US2026040908A1Method for manufacturing semiconductor deviceHPSP CO LTD·Filed 2023·Application pending·0 cites
- 1734US2023204290A1High pressure heat treatment apparatusHPSP CO LTD·Filed 2022·Application pending·0 cites
- 1834US2025017015A1Semiconductor device and semiconductor device manufacturing methodHPSP CO LTD·Filed 2024·Application pending·0 cites
- 1934US2025157834A1High-pressure heat treatment apparatus and gas monitoring module used thereforHPSP CO LTD·Filed 2022·Application pending·0 cites
- 2034US2023204288A1High pressure heat treatment apparatusHPSP CO LTD·Filed 2022·Application pending·0 cites
- 2129US2025239464A1High-pressure substrate processing apparatus and processing gas line used thereforHPSP CO LTD·Filed 2025·Application pending·0 cites
- 2226US2025273483A1High-pressure substrate processing apparatusHPSP CO LTD·Filed 2025·Application pending·0 cites
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