Assignee
HOSSEINI KHALIL
DE·14 granted patents·33 citations·filing 2006–2012
Top patents by PatentIndex Score
14 records- 0190US9048338B2Device including two power semiconductor chips and manufacturing thereofHOSSEINI KHALIL·Filed 2011·Granted Jun 2, 2015·12 cites·5 claims
- 0285US8076238B2Electronic device and method for productionHOSSEINI KHALIL·Filed 2007·Granted Dec 13, 2011·9 cites·14 claims
- 0378US8552571B2Electronic device and method for productionHOSSEINI KHALIL·Filed 2011·Granted Oct 8, 2013·3 cites·14 claims
- 0471US8399996B2Chip carrierHOSSEINI KHALIL·Filed 2011·Granted Mar 19, 2013·2 cites·19 claims
- 0569US8872315B2Electronic device and method of fabricating an electronic deviceHOSSEINI KHALIL·Filed 2012·Granted Oct 28, 2014·2 cites·15 claims
- 0668US8824145B2Electric device package and method of making an electric device packageHOSSEINI KHALIL·Filed 2012·Granted Sep 2, 2014·2 cites·28 claims
- 0766US9406646B2Electronic device and method for fabricating an electronic deviceHOSSEINI KHALIL·Filed 2011·Granted Aug 2, 2016·2 cites·12 claims
- 0861US8598694B2Chip-package having a cavity and a manufacturing method thereofHOSSEINI KHALIL·Filed 2011·Granted Dec 3, 2013·1 cites·24 claims
- 0948US8723299B2Method and system for forming a thin semiconductor deviceHOSSEINI KHALIL·Filed 2010·Granted May 13, 2014·0 cites·5 claims
- 1045US8610274B2Die structure, die arrangement and method of processing a dieHOSSEINI KHALIL·Filed 2010·Granted Dec 17, 2013·0 cites·28 claims
- 1144US8912047B2Method for producing a metal layer on a substrate and deviceHOSSEINI KHALIL·Filed 2011·Granted Dec 16, 2014·0 cites·24 claims
- 1244US8836120B2Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layerHOSSEINI KHALIL·Filed 2011·Granted Sep 16, 2014·0 cites·34 claims
- 1343US8581371B2Connection element for a semiconductor component and method for producing the sameHOSSEINI KHALIL·Filed 2006·Granted Nov 12, 2013·0 cites·15 claims
- 1441US11189537B2Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuitHOSSEINI KHALIL·Filed 2012·Granted Nov 30, 2021·0 cites·20 claims
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