Assignee
HIRAKI TSUTOMU
JP·4 granted patents·6 citations·filing 2008–2010
Top patents by PatentIndex Score
4 records- 0165US8215005B2Chip mounting systemHIRAKI TSUTOMU·Filed 2008·Granted Jul 10, 2012·4 cites·8 claims
- 0250US8205328B2Components packaging methodHIRAKI TSUTOMU·Filed 2010·Granted Jun 26, 2012·1 cites·2 claims
- 0350US8122595B2Electronic parts mounting deviceHIRAKI TSUTOMU·Filed 2010·Granted Feb 28, 2012·1 cites·3 claims
- 0430US8756800B2Electronic component mounting methodHIRAKI TSUTOMU·Filed 2010·Granted Jun 24, 2014·0 cites·2 claims
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