Assignee
HICON CO LTD
KR·9 granted patents·6 citations·filing 2012–2023
Top patents by PatentIndex Score
9 records- 0193US11668744B2Contact and socket device for burning-in and testing semiconductor ICHICON CO LTD·Filed 2021·Granted Jun 6, 2023·4 cites·50 claims
- 0287US11561241B2Spring contact and test socket with sameHICON CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·4 claims
- 0372US11982688B2Spring contact and test socket with sameHICON CO LTD·Filed 2022·Granted May 14, 2024·0 cites·2 claims
- 0458US12571815B2Contact pin and spring contact including the sameHICON CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·12 claims
- 0548US11387584B1Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket deviceHICON CO LTD·Filed 2021·Granted Jul 12, 2022·0 cites·22 claims
- 0641US9494616B2Socket device for testing semiconductor deviceHICON CO LTD·Filed 2013·Granted Nov 15, 2016·0 cites·7 claims
- 0740US10094852B2Spring contactHICON CO LTD·Filed 2013·Granted Oct 9, 2018·0 cites·7 claims
- 0840US9435853B2Socket device for an IC testHICON CO LTD·Filed 2012·Granted Sep 6, 2016·0 cites·15 claims
- 0939US12248001B2Lidless BGA socket apparatus for testing semiconductor deviceHICON CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·30 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →