Assignee
HETZEL WOLFGANG
DE·2 granted patents·9 citations·filing 2004–2006
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0171US8624372B2Semiconductor component comprising an interposer substrateHETZEL WOLFGANG·Filed 2006·Granted Jan 7, 2014·6 cites·19 claims
- 0246US8072085B2Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the sameHETZEL WOLFGANG·Filed 2004·Granted Dec 6, 2011·3 cites·16 claims
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