Assignee
HERAEUS MATERIALS TECH GMBH
DE·4 granted patents·9 pending applications·15 citations·filing 2012–2014
Top patents by PatentIndex Score
13 records- 0189US9056307B2CatalystHERAEUS MATERIALS TECH GMBH·Filed 2013·Granted Jun 16, 2015·8 cites·8 claims
- 0287US9126187B2CatalystHERAEUS MATERIALS TECH GMBH·Filed 2013·Granted Sep 8, 2015·6 cites·14 claims
- 0354US2013040807A1Non-woven material or netting of metal fibersHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 0452US9214444B2Aluminum coated copper ribbonHERAEUS MATERIALS TECH GMBH·Filed 2013·Granted Dec 15, 2015·1 cites·24 claims
- 0550US2015021378A1Method of joining components using metal paste with oxidizing agentsHERAEUS MATERIALS TECH GMBH·Filed 2014·Application pending·0 cites
- 0647US2016059361A1Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinterHERAEUS MATERIALS TECH GMBH·Filed 2014·Application pending·0 cites
- 0746US8974707B2Planar or tubular sputtering target and method for the production thereofHERAEUS MATERIALS TECH GMBH·Filed 2013·Granted Mar 10, 2015·0 cites·13 claims
- 0843US2015098170A1Aluminum coated copper bond wire and method of making the sameHERAEUS MATERIALS TECH GMBH·Filed 2013·Application pending·0 cites
- 0942US2015038034A1Flat structure, particularly textile, containing precious metal wireHERAEUS MATERIALS TECH GMBH·Filed 2013·Application pending·0 cites
- 1039US2013142568A13n copper wires with trace additions for bonding in microelectronics devicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 1135US2013140068A1Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics DevicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 1224US2014063762A1Silver alloy wire for bonding applicationsHERAEUS MATERIALS TECH GMBH·Filed 2013·Application pending·0 cites
- 1322US2013126934A1Bonding wire for semiconductor devicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
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