Assignee
HEFEI SMAT TECH CO LTD
CN·3 granted patents·4 pending applications·0 citations·filing 2018–2025
Top patents by PatentIndex Score
7 records- 0166US11735503B2Method of manufacturing chip packaging structure with dissipation layer, flange and sealing pinHEFEI SMAT TECH CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 0262US2025218919A1Semiconductor package structure and packaging methodHEFEI SMAT TECH CO LTD·Filed 2024·Application pending·0 cites
- 0354US2023386959A1Chip heat dissipating structure, process and semiconductor deviceHEFEI SMAT TECH CO LTD·Filed 2023·Application pending·0 cites
- 0453US11239140B2Chip packaging structure with heat dissipation layer, flange and sealing pinHEFEI SMAT TECH CO LTD·Filed 2018·Granted Feb 1, 2022·0 cites·9 claims
- 0552US2025357408A1Stacked chip package structure and method for forming the sameHEFEI SMAT TECH CO LTD·Filed 2025·Application pending·0 cites
- 0649US12500153B2Exposed bonding pad of chip package and manufacturing method thereofHEFEI SMAT TECH CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·6 claims
- 0749US2025279337A1Stacked chip package structure and method for forming the sameHEFEI SMAT TECH CO LTD·Filed 2025·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →