Assignee
HEFEI SHENGDA ELECTRONICS TECH INDUSTRY CO LTD
CN·2 granted patents·0 citations·filing 2022–2024
Top patents by PatentIndex Score
2 records- 0159US12128652B2Ceramic package for quantum computing and method for preparationHEFEI SHENGDA ELECTRONICS TECH INDUSTRY CO LTD·Filed 2024·Granted Oct 29, 2024·0 cites·5 claims
- 0245US11725294B2Methods for partial gold plating of metal packaging housings and packaging housings thereofHEFEI SHENGDA ELECTRONICS TECH INDUSTRY CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·15 claims
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