Assignee
HEDLER HARRY
DE·6 granted patents·10 pending applications·11 citations·filing 2005–2012
Top patents by PatentIndex Score
16 records- 0187US9097808B2Radiation detector and imaging systemHEDLER HARRY·Filed 2012·Granted Aug 4, 2015·9 cites·11 claims
- 0261US8124521B2Electrical through contactHEDLER HARRY·Filed 2007·Granted Feb 28, 2012·2 cites·41 claims
- 0353US2013249035A1Silicon photomultiplier and radiation detectorHEDLER HARRY·Filed 2011·Application pending·0 cites
- 0452US2009212420A1integrated circuit device and method for fabricating sameHEDLER HARRY·Filed 2008·Application pending·0 cites
- 0546US2011217812A1Integrated circuit device and method for fabricating same with an interposer substrateHEDLER HARRY·Filed 2011·Application pending·0 cites
- 0645US8106511B2Reduced-stress through-chip feature and method of making the sameHEDLER HARRY·Filed 2008·Granted Jan 31, 2012·0 cites·24 claims
- 0744US2008079149A1Circuit board arrangement and method for producing a circuit board arrangementHEDLER HARRY·Filed 2006·Application pending·0 cites
- 0843US9151850B2Radiation detector and imaging systemHEDLER HARRY·Filed 2012·Granted Oct 6, 2015·0 cites·13 claims
- 0941US8598716B2Semiconductor apparatus having stacked semiconductor componentsHEDLER HARRY·Filed 2005·Granted Dec 3, 2013·0 cites·3 claims
- 1041US2007023886A1Method for producing a chip arrangement, a chip arrangement and a multichip deviceHEDLER HARRY·Filed 2006·Application pending·0 cites
- 1140US2007032059A1Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structureHEDLER HARRY·Filed 2005·Application pending·0 cites
- 1240US2007084944A1Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stackingHEDLER HARRY·Filed 2005·Application pending·0 cites
- 1338US2014084428A1Integrated circuit with electrical through-contact and method for producing electrical through-contactHEDLER HARRY·Filed 2012·Application pending·0 cites
- 1438US2006094165A1Method for fabricating semiconductor componentsHEDLER HARRY·Filed 2005·Application pending·0 cites
- 1536US9884759B2Thermoelement including a three-dimensional microstructure, and method for producing a thermoelementHEDLER HARRY·Filed 2010·Granted Feb 6, 2018·0 cites·16 claims
- 1636US2012180839A1Thermo-electric energy converter having a three-dimensional micro-structure, method for producing the energy converter and use of the energy converterHEDLER HARRY·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HEDLER HARRY files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →