Assignee
HAN WON-GIL
KR·1 granted patent·3 pending applications·6 citations·filing 2011–2014
Top patents by PatentIndex Score
4 records- 0174US8513793B2Stacked semiconductor package and method of fabricating the sameHAN WON-GIL·Filed 2011·Granted Aug 20, 2013·6 cites·20 claims
- 0239US2013093080A1Multi-chip package and method of manufacturing the sameHAN WON-GIL·Filed 2012·Application pending·0 cites
- 0336US2014339290A1Wire bonding method and semiconductor package manufactured using the sameHAN WON-GIL·Filed 2014·Application pending·0 cites
- 0431US2012056178A1Multi-chip packagesHAN WON-GIL·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →