Assignee
HAN SEUNG
KR·2 granted patents·2 pending applications·0 citations·filing 2011–2013
Top patents by PatentIndex Score
4 records- 0137US8928158B2Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the sameHAN SEUNG·Filed 2012·Granted Jan 6, 2015·0 cites·13 claims
- 0237US8531044B2Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the compositionHAN SEUNG·Filed 2011·Granted Sep 10, 2013·0 cites·10 claims
- 0337US2014179834A1Epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the sameHAN SEUNG·Filed 2013·Application pending·0 cites
- 0433US2013158165A1Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the sameHAN SEUNG·Filed 2012·Application pending·0 cites
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