Assignee
HAN CALEB C
US·2 granted patents·1 pending application·1 citations·filing 2012–2014
Top patents by PatentIndex Score
3 records- 0159US8710636B1Lead frame array package with flip chip die attachHAN CALEB C·Filed 2013·Granted Apr 29, 2014·1 cites·9 claims
- 0248US8969139B2Lead frame array package with flip chip die attachHAN CALEB C·Filed 2014·Granted Mar 3, 2015·0 cites·6 claims
- 0334US2013285259A1Method and system for wafer and strip level batch die attach assemblyHAN CALEB C·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HAN CALEB C files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →