Assignee
GREAT WALL SEMICONDUCTOR CORP
US·19 granted patents·5 pending applications·104 citations·filing 2003–2020
Top patents by PatentIndex Score
24 records- 0195US7842568B2Lateral power semiconductor device for high frequency power conversion system, has isolation layer formed over substrate for reducing minority carrier storage in substrateGREAT WALL SEMICONDUCTOR CORP·Filed 2007·Granted Nov 30, 2010·43 cites·9 claims
- 0281US7605435B2Bi-directional MOSFET power switch with single metal layerGREAT WALL SEMICONDUCTOR CORP·Filed 2007·Granted Oct 20, 2009·9 cites·4 claims
- 0380US6972464B2Power MOSFETGREAT WALL SEMICONDUCTOR CORP·Filed 2003·Granted Dec 6, 2005·35 cites·8 claims
- 0476US9666703B2Semiconductor devices with cavitiesGREAT WALL SEMICONDUCTOR CORP·Filed 2015·Granted May 30, 2017·2 cites·6 claims
- 0576US9640638B2Semiconductor device and method of forming a power MOSFET with interconnect structure to achieve lower RDSONGREAT WALL SEMICONDUCTOR CORP·Filed 2013·Granted May 2, 2017·4 cites·25 claims
- 0670US10164088B2Trench MOSFET with depleted gate shield and method of manufactureGREAT WALL SEMICONDUCTOR CORP·Filed 2017·Granted Dec 25, 2018·1 cites·16 claims
- 0768US10163639B2Trench MOSFET with depleted gate shield and method of manufactureGREAT WALL SEMICONDUCTOR CORP·Filed 2016·Granted Dec 25, 2018·1 cites·13 claims
- 0868US9299774B2Device structure and methods of forming superjunction lateral power MOSFET with surrounding LDDGREAT WALL SEMICONDUCTOR CORP·Filed 2014·Granted Mar 29, 2016·2 cites·25 claims
- 0965US10529651B2Co-packaged die on leadframe with common contactGREAT WALL SEMICONDUCTOR CORP·Filed 2016·Granted Jan 7, 2020·1 cites·18 claims
- 1064US10741479B2Co-packaged die on leadframe with common contactGREAT WALL SEMICONDUCTOR CORP·Filed 2020·Granted Aug 11, 2020·0 cites·20 claims
- 1161US7800223B2Chip-scale monolithic load switch for portable applicationsGREAT WALL SEMICONDUCTOR CORP·Filed 2006·Granted Sep 21, 2010·2 cites·21 claims
- 1258US10825926B2Trench MOSFET with depleted gate shield and method of manufactureGREAT WALL SEMICONDUCTOR CORP·Filed 2018·Granted Nov 3, 2020·0 cites·17 claims
- 1353US10153167B2Semiconductor devices with cavitiesGREAT WALL SEMICONDUCTOR CORP·Filed 2017·Granted Dec 11, 2018·0 cites·19 claims
- 1451US10199459B2Superjunction with surrounding lightly doped drain regionGREAT WALL SEMICONDUCTOR CORP·Filed 2016·Granted Feb 5, 2019·0 cites·10 claims
- 1550US9018706B2Monolithic MOSFET and Schottky diode for mobile phone boost converterGREAT WALL SEMICONDUCTOR CORP·Filed 2014·Granted Apr 28, 2015·0 cites·20 claims
- 1646US7649247B2Radiation hardened lateral MOSFET structureGREAT WALL SEMICONDUCTOR CORP·Filed 2007·Granted Jan 19, 2010·0 cites·20 claims
- 1746US7612418B2Monolithic power semiconductor structures including pairs of integrated devicesGREAT WALL SEMICONDUCTOR CORP·Filed 2004·Granted Nov 3, 2009·3 cites·9 claims
- 1845US2009014791A1Lateral Power MOSFET With Integrated Schottky DiodeGREAT WALL SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 1944US7432595B2System and method to reduce metal series resistance of bumped chipGREAT WALL SEMICONDUCTOR CORP·Filed 2004·Granted Oct 7, 2008·1 cites·14 claims
- 2041US2009321784A1Semiconductor Device and Method of Forming Lateral Power MOSFET with Integrated Schottky Diode on Monolithic SubstrateGREAT WALL SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
- 2140US10707327B2MOSFET with reduced resistanceGREAT WALL SEMICONDUCTOR CORP·Filed 2015·Granted Jul 7, 2020·0 cites·16 claims
- 2239US2008036070A1Bond Wireless PackageGREAT WALL SEMICONDUCTOR CORP·Filed 2004·Application pending·0 cites
- 2335US2008296690A1Metal interconnect System and Method for Direct Die AttachmentGREAT WALL SEMICONDUCTOR CORP·Filed 2004·Application pending·0 cites
- 2432US2013015569A1Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor DieGREAT WALL SEMICONDUCTOR CORP·Filed 2011·Application pending·0 cites
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