Assignee
GLOBAL CIRCUIT INNOVATIONS INCORPORATED
US·3 granted patents·6 citations·filing 2013–2015
Top patents by PatentIndex Score
3 records- 0173US9935028B2Method and apparatus for printing integrated circuit bond connectionsGLOBAL CIRCUIT INNOVATIONS INCORPORATED·Filed 2013·Granted Apr 3, 2018·3 cites·18 claims
- 0271US9824948B2Integrated circuit with printed bond connectionsGLOBAL CIRCUIT INNOVATIONS INCORPORATED·Filed 2015·Granted Nov 21, 2017·2 cites·10 claims
- 0361US9711480B2Environmental hardened packaged integrated circuitGLOBAL CIRCUIT INNOVATIONS INCORPORATED·Filed 2015·Granted Jul 18, 2017·1 cites·10 claims
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