Assignee
FURUSAWA AKIO
JP·3 granted patents·1 pending application·1 citations·filing 2007–2010
Top patents by PatentIndex Score
4 records- 0158US8227090B2Bonding material, electronic component, bonding structure and electronic deviceFURUSAWA AKIO·Filed 2007·Granted Jul 24, 2012·1 cites·16 claims
- 0246US8421246B2Joint structure and electronic componentFURUSAWA AKIO·Filed 2009·Granted Apr 16, 2013·0 cites·11 claims
- 0343US2010294550A1Bonding material, electronic component and bonded structureFURUSAWA AKIO·Filed 2008·Application pending·0 cites
- 0440US8338966B2Joint structure, joining material, and method for producing joining material containing bismuthFURUSAWA AKIO·Filed 2010·Granted Dec 25, 2012·0 cites·8 claims
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