Assignee
FUNG DEIN-RUN
TW·10 granted patents·2 pending applications·32 citations·filing 2009–2012
Top patents by PatentIndex Score
12 records- 0187US8574698B2Water-based hot-foam adhesive panelFUNG DEIN-RUN·Filed 2011·Granted Nov 5, 2013·17 cites·12 claims
- 0280US8569442B2Hydrogenation process for improving yield of hydrogenated bisphenol-A-based epoxy resinFUNG DEIN-RUN·Filed 2011·Granted Oct 29, 2013·4 cites·3 claims
- 0379US8314186B2Adhesive composition for use in bonding of polarizing plateFUNG DEIN-RUN·Filed 2010·Granted Nov 20, 2012·3 cites·8 claims
- 0472US8198347B2High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereofFUNG DEIN-RUN·Filed 2009·Granted Jun 12, 2012·4 cites·8 claims
- 0569US8940363B2Preparation of hollow polymer microspheresFUNG DEIN RUN·Filed 2012·Granted Jan 27, 2015·2 cites·3 claims
- 0662US9243132B2High-frequency copper foil covered substrate and compound material used thereinFUNG DEIN-RUN·Filed 2012·Granted Jan 26, 2016·2 cites·10 claims
- 0750US8653300B2Method for making hindered phenolic antioxidantFUNG DEIN-RUN·Filed 2009·Granted Feb 18, 2014·0 cites·3 claims
- 0846US8444871B2Slurry composition containing cracking agentFUNG DEIN-RUN·Filed 2011·Granted May 21, 2013·0 cites·4 claims
- 0942US8653296B2Method for preparing ester of cyclohexane polycarboxylic acid from ester of benzene polycarboxylic acidFUNG DEIN-RUN·Filed 2012·Granted Feb 18, 2014·0 cites·12 claims
- 1041US8580879B2Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereofFUNG DEIN-RUN·Filed 2011·Granted Nov 12, 2013·0 cites·10 claims
- 1140US2012315475A1Heat-resistant anti-static adhesive filmFUNG DEIN-RUN·Filed 2011·Application pending·0 cites
- 1238US2011223387A1non-pvc type calendered polyolefin sheet and the process thereofFUNG DEIN-RUN·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →