Assignee
FUKUI PREC COMPONENT SHENZHEN
CN·26 granted patents·24 pending applications·54 citations·filing 2007–2017
Top patents by PatentIndex Score
50 records- 0183US8009432B2Retaining apparatus for a flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Aug 30, 2011·16 cites·8 claims
- 0278US9066431B2Method for manufacturing printed circuit board with patterned electrically conductive layer therein visibleFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Jun 23, 2015·4 cites·8 claims
- 0377US8049113B2Printed circuit boardsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Nov 1, 2011·5 cites·2 claims
- 0474US7916499B2Apparatus for holding printed circuit boardsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Mar 29, 2011·8 cites·7 claims
- 0570US10111336B1Method of making a flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted Oct 23, 2018·1 cites·8 claims
- 0669US9992858B2Printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted Jun 5, 2018·1 cites·4 claims
- 0768US7728232B2Printed circuit board assembly having adhesive layerFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Jun 1, 2010·5 cites·20 claims
- 0866US9277640B2Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted Mar 1, 2016·1 cites·8 claims
- 0966US9072173B2Rigid-flex printed circuit board and method for making sameFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Jun 30, 2015·1 cites·14 claims
- 1065US9107311B2Method for manufacturing printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Aug 11, 2015·2 cites·4 claims
- 1165US7581312B2Method for manufacturing multilayer flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Sep 1, 2009·3 cites·13 claims
- 1263US8052881B2Method of manufacturing multilayer printed circuit board having buried holesFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Nov 8, 2011·3 cites·11 claims
- 1361US7511962B2Flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Mar 31, 2009·2 cites·20 claims
- 1460US10658265B2Heat dissipation structure, method for making the same, and electronic device having the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted May 19, 2020·0 cites·6 claims
- 1560US7789989B2Method for manufacturing rigid-flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Sep 7, 2010·2 cites·8 claims
- 1658US10012454B2Heat dissipation device and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2015·Granted Jul 3, 2018·0 cites·10 claims
- 1757US2009301763A1Ink, method of forming electrical traces using the same and circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1856US9357631B2Flexible printed circuit board and method for making sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted May 31, 2016·0 cites·12 claims
- 1956US7998332B2Electroplating methodFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Aug 16, 2011·0 cites·8 claims
- 2054US2009291230A1Ink and method of forming electrical traces using the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2009·Application pending·0 cites
- 2152US2009120671A1Fpcb substrate and method of manufacturing the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 2252US2008248258A1Mounting support for retaining a flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Application pending·0 cites
- 2351US2010018638A1Method for manufacturing flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2009·Application pending·0 cites
- 2451US2009286006A1Ink and method of forming electrical traces using the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 2550US9288914B2Method of manufacturing a printed circuit board with circuit visibleFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Mar 15, 2016·0 cites·8 claims
- 2650US9210811B2Compact rigid-flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Dec 8, 2015·0 cites·6 claims
- 2750US2010021652A1Method of forming electrical tracesFUKUI PREC COMPONENT SHENZHEN·Filed 2009·Application pending·0 cites
- 2850US2015053466A1Printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 2949US2009050677A1Method of welding electronic components on pcbsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 3049US2009246357A1Method of forming circuits on circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 3148US2014110152A1Printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Application pending·0 cites
- 3247US8042265B2Method for manufacturing multilayer flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Oct 25, 2011·0 cites·10 claims
- 3347US2009038828A1Flexible printed circuit board substrate and flexible printed circuit board fabricated using the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 3445US2015101785A1Heat dissipation device and a method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 3545US2015189760A1Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 3645US2008302258A1Screen printing stencil and method for manufacturing the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Application pending·0 cites
- 3745US2010021653A1Method of forming electrical traces on substrateFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 3844US7903424B2Flexible printed circuit board holderFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Mar 8, 2011·0 cites·9 claims
- 3944US2009178276A1Method for forming circuit in making printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 4043US9066417B2Method for manufacturing printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Jun 23, 2015·0 cites·19 claims
- 4143US2009304911A1Method of forming circuits on circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 4241US7987586B2Method for manufacturing printed circuit board having different thicknesses in different areasFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Aug 2, 2011·0 cites·6 claims
- 4341US2008308042A1Apparatus for plasma-processing flexible printed circuit boardsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 4439US2009217520A1Method for forming solder lumps on printed circuit board substrateFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 4539US2008230168A1Laminator and laminating methodFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Application pending·0 cites
- 4638US8049511B2Method of detecting faulty via holes in printed circuit boardsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Nov 1, 2011·0 cites·6 claims
- 4737US7872744B2Visual inspection apparatus for flexible printed circuit boardsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Jan 18, 2011·0 cites·20 claims
- 4833US2009027072A1Apparatus for testing chips with ball grid arrayFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 4933US2009000115A1Surface mounting apparatus and methodFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Application pending·0 cites
- 5032US2008286122A1Gas-driven liquid pumpFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when FUKUI PREC COMPONENT SHENZHEN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →