Assignee
FUJII SEIYA
JP·9 granted patents·46 citations·filing 2009–2012
Top patents by PatentIndex Score
9 records- 0194US8519514B2Semiconductor device and manufacturing method thereofFUJII SEIYA·Filed 2010·Granted Aug 27, 2013·23 cites·18 claims
- 0275US8778805B2Method for manufacturing semiconductor deviceFUJII SEIYA·Filed 2012·Granted Jul 15, 2014·4 cites·15 claims
- 0375US8304877B2Semiconductor deviceFUJII SEIYA·Filed 2009·Granted Nov 6, 2012·6 cites·7 claims
- 0469US8072069B2Semiconductor device and method of manufacturing a semiconductor deviceFUJII SEIYA·Filed 2009·Granted Dec 6, 2011·4 cites·20 claims
- 0568US8507805B2Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboardFUJII SEIYA·Filed 2009·Granted Aug 13, 2013·4 cites·18 claims
- 0666US8178971B2Semiconductor device and method of manufacturing the sameFUJII SEIYA·Filed 2009·Granted May 15, 2012·3 cites·13 claims
- 0761US8283779B2Peel-resistant semiconductor device with improved connector density, and method of manufacturing the sameFUJII SEIYA·Filed 2009·Granted Oct 9, 2012·2 cites·19 claims
- 0848US8098496B2Wiring board for semiconductor deviceFUJII SEIYA·Filed 2009·Granted Jan 17, 2012·0 cites·20 claims
- 0943US8853005B2Method for manufacturing semiconductor deviceFUJII SEIYA·Filed 2011·Granted Oct 7, 2014·0 cites·20 claims
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