Assignee
FUERGUT EDWARD
DE·9 granted patents·4 pending applications·31 citations·filing 2005–2012
Top patents by PatentIndex Score
13 records- 0190US8778733B2Semiconductor package and methods of formation thereofFUERGUT EDWARD·Filed 2012·Granted Jul 15, 2014·11 cites·35 claims
- 0287US8872288B2Apparatus comprising and a method for manufacturing an embedded MEMS deviceFUERGUT EDWARD·Filed 2012·Granted Oct 28, 2014·7 cites·22 claims
- 0374US8148210B1Method for fabricating a semiconductor chip panelFUERGUT EDWARD·Filed 2010·Granted Apr 3, 2012·4 cites·22 claims
- 0472US8786111B2Semiconductor packages and methods of formation thereofFUERGUT EDWARD·Filed 2012·Granted Jul 22, 2014·3 cites·30 claims
- 0566US9129959B2Method for manufacturing an electronic module and an electronic moduleFUERGUT EDWARD·Filed 2012·Granted Sep 8, 2015·2 cites·26 claims
- 0663US8749029B2Method of manufacturing a semiconductor deviceFUERGUT EDWARD·Filed 2012·Granted Jun 10, 2014·1 cites·19 claims
- 0762US8580070B2Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor waferFUERGUT EDWARD·Filed 2005·Granted Nov 12, 2013·2 cites·19 claims
- 0861US9230894B2Methods for manufacturing a chip packageFUERGUT EDWARD·Filed 2012·Granted Jan 5, 2016·1 cites·27 claims
- 0942US8815651B2Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrierFUERGUT EDWARD·Filed 2011·Granted Aug 26, 2014·0 cites·14 claims
- 1042US2006255435A1Method for encapsulating a semiconductor device and semiconductor deviceFUERGUT EDWARD·Filed 2006·Application pending·0 cites
- 1141US2013292852A1Chip embedded packages and methods for forming a chip embedded packageFUERGUT EDWARD·Filed 2012·Application pending·0 cites
- 1240US2013337614A1Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatusFUERGUT EDWARD·Filed 2012·Application pending·0 cites
- 1340US2013161867A1Molding Apparatus and a Method for MoldingFUERGUT EDWARD·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →