Assignee
FOWLER MICHAEL LEE
US·1 granted patent·1 pending application·1 citations·filing 2010–2010
Technology mixH05K2
Top patents by PatentIndex Score
2 records- 0150US9072199B2Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plugFOWLER MICHAEL LEE·Filed 2010·Granted Jun 30, 2015·1 cites·26 claims
- 0228US2012170224A1Circuit board frame with integral heat sink for enhanced thermal transferFOWLER MICHAEL LEE·Filed 2010·Application pending·0 cites
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