Assignee
FOONG CHEE SENG
MY·11 granted patents·4 pending applications·29 citations·filing 2007–2015
Top patents by PatentIndex Score
15 records- 0186US8860212B1Fluid cooled semiconductor die packageFOONG CHEE SENG·Filed 2013·Granted Oct 14, 2014·9 cites·18 claims
- 0280US9202770B1Non-homogeneous molding of packaged semiconductor devicesFOONG CHEE SENG·Filed 2014·Granted Dec 1, 2015·5 cites·9 claims
- 0379US9209147B1Method of forming pillar bumpFOONG CHEE SENG·Filed 2014·Granted Dec 8, 2015·6 cites·13 claims
- 0476US9269659B1Interposer with overmolded viasFOONG CHEE SENG·Filed 2015·Granted Feb 23, 2016·2 cites·18 claims
- 0572US8643172B2Heat spreader for center gate moldingFOONG CHEE SENG·Filed 2007·Granted Feb 4, 2014·6 cites·5 claims
- 0652US9134193B2Stacked die sensor packageFOONG CHEE SENG·Filed 2013·Granted Sep 15, 2015·1 cites·15 claims
- 0751US9474162B2Circuit substrate and method of manufacturing sameFOONG CHEE SENG·Filed 2014·Granted Oct 18, 2016·0 cites·10 claims
- 0850US2015342069A1Housing for electronic devicesFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 0949US9053972B1Pillar bump formed using spot-laserFOONG CHEE SENG·Filed 2013·Granted Jun 9, 2015·0 cites·9 claims
- 1046US9401345B2Semiconductor device package with organic interposerFOONG CHEE SENG·Filed 2014·Granted Jul 26, 2016·0 cites·14 claims
- 1146US2015183131A1Semiconductor wafer dicing bladeFOONG CHEE SENG·Filed 2013·Application pending·0 cites
- 1243US9177834B2Power bar design for lead frame-based packagesFOONG CHEE SENG·Filed 2014·Granted Nov 3, 2015·0 cites·8 claims
- 1343US9159682B2Copper pillar bump and flip chip package using sameFOONG CHEE SENG·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 1443US2015200177A1Wafer level package with redistribution layer formed with metallic powderFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 1542US2015311143A1Lead frames having metal traces with metal stubsFOONG CHEE SENG·Filed 2014·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when FOONG CHEE SENG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →