Assignee
FOIL TECHNOLOGY DEV CORP
US·2 granted patents·5 citations·filing 1997–1997
Top patents by PatentIndex Score
2 records- 0131US5919379ACopper-foil having a protective layer and copper-clad laminates using sameFOIL TECHNOLOGY DEV CORP·Filed 1997·Granted Jul 6, 1999·4 cites·6 claims
- 0224US6060666AElectrolytic layer applied to metallic foil to promote adhesion to a polymeric substrateFOIL TECHNOLOGY DEV CORP·Filed 1997·Granted May 9, 2000·1 cites·5 claims
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