Assignee
FIRST INTERNATIONAL COMPUTER I
TW·4 granted patents·169 citations·filing 1998–1999
Top patents by PatentIndex Score
4 records- 0193US6077724AMulti-chips semiconductor package and fabrication methodFIRST INTERNATIONAL COMPUTER I·Filed 1998·Granted Jun 20, 2000·126 cites·12 claims
- 0247US5980003ADetachable case assembly for computerFIRST INTERNATIONAL COMPUTER I·Filed 1998·Granted Nov 9, 1999·23 cites·7 claims
- 0346US6062790ACountersunk hole reinforcing structureFIRST INTERNATIONAL COMPUTER I·Filed 1999·Granted May 16, 2000·17 cites·1 claims
- 0428US6065611ACombination rack for holding a computer mainframe and an expansion unitFIRST INTERNATIONAL COMPUTER I·Filed 1998·Granted May 23, 2000·3 cites·4 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →