Assignee
FILNEX INC
JP·7 granted patents·1 pending application·4 citations·filing 2020–2024
Top patents by PatentIndex Score
8 records- 0197US11152216B2Method for manufacturing semiconductor deviceFILNEX INC·Filed 2020·Granted Oct 19, 2021·4 cites·20 claims
- 0279US12068166B2Semiconductor substrateFILNEX INC·Filed 2023·Granted Aug 20, 2024·0 cites·16 claims
- 0376US12183636B2Semiconductor substrate, method for manufacturing semiconductor substrate and method for manufacturing semiconductor deviceFILNEX INC·Filed 2023·Granted Dec 31, 2024·0 cites·10 claims
- 0473US11670514B2Method for manufacturing semiconductor device and semiconductor substrateFILNEX INC·Filed 2021·Granted Jun 6, 2023·0 cites·6 claims
- 0568US11894272B2Semiconductor substrate, method for manufacturing semiconductor substrate and method for manufacturing semiconductor deviceFILNEX INC·Filed 2021·Granted Feb 6, 2024·0 cites·12 claims
- 0661US2024312779A1Semiconductor substrate manufacturing method, semiconductor substrate, and semiconductor substrate manufacturing apparatusFILNEX INC·Filed 2024·Application pending·0 cites
- 0752US12136569B2Semiconductor device manufacturing method and semiconductor device manufacturing systemFILNEX INC·Filed 2022·Granted Nov 5, 2024·0 cites·13 claims
- 0851US11798805B2Method for manufacturing semiconductor device and semiconductor substrateFILNEX INC·Filed 2021·Granted Oct 24, 2023·0 cites·9 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →