Assignee
FENG TAO
US·12 granted patents·10 pending applications·38 citations·filing 2007–2013
Top patents by PatentIndex Score
22 records- 0189US8217748B2Compact inductive power electronics packageFENG TAO·Filed 2009·Granted Jul 10, 2012·18 cites·20 claims
- 0281US8987878B2Substrateless power device packagesFENG TAO·Filed 2010·Granted Mar 24, 2015·5 cites·7 claims
- 0374US8466060B2Stackable power MOSFET, power MOSFET stack, and process of manufactureFENG TAO·Filed 2010·Granted Jun 18, 2013·4 cites·24 claims
- 0472US8507362B2Process of forming ultra thin wafers having an edge support ringFENG TAO·Filed 2011·Granted Aug 13, 2013·2 cites·2 claims
- 0571US8716063B2Wafer level chip scale package and process of manufactureFENG TAO·Filed 2011·Granted May 6, 2014·2 cites·20 claims
- 0670US8198285B2Pyrazine derivativesFENG TAO·Filed 2011·Granted Jun 12, 2012·1 cites·6 claims
- 0769US8058727B2Standing chip scale packageFENG TAO·Filed 2010·Granted Nov 15, 2011·2 cites·21 claims
- 0868US8242013B2Virtually substrate-less composite power semiconductor device and methodFENG TAO·Filed 2010·Granted Aug 14, 2012·2 cites·8 claims
- 0962US8866267B2Semiconductor device with substrate-side exposed device-side electrode and method of fabricationFENG TAO·Filed 2010·Granted Oct 21, 2014·1 cites·18 claims
- 1059US8222078B2Chip scale surface mounted semiconductor device package and process of manufactureFENG TAO·Filed 2009·Granted Jul 17, 2012·1 cites·14 claims
- 1150US8294254B2Chip scale surface mounted semiconductor device package and process of manufactureFENG TAO·Filed 2012·Granted Oct 23, 2012·0 cites·14 claims
- 1249US8796858B2Virtually substrate-less composite power semiconductor deviceFENG TAO·Filed 2012·Granted Aug 5, 2014·0 cites·13 claims
- 1348US2013123275A1Pyrazine derivativesFENG TAO·Filed 2012·Application pending·0 cites
- 1447US2012202320A1Wafer-level chip scale packaging of metal-oxide-semiconductor field-effect-transistors (mosfet's)FENG TAO·Filed 2012·Application pending·0 cites
- 1547US2016001405A1An anti-frozen processing apparatus and methodFENG TAO·Filed 2013·Application pending·0 cites
- 1647US2008166837A1Power MOSFET wafer level chip-scale packageFENG TAO·Filed 2007·Application pending·0 cites
- 1746US2013117162A1Method for fair share allocation in a multi-echelon service supply chain that considers supercession and repair relationshipsFENG TAO·Filed 2012·Application pending·0 cites
- 1845US2008178099A1Method of using block diagram to combine logic expressionsFENG TAO·Filed 2007·Application pending·0 cites
- 1945US2008242052A1Method of forming ultra thin chips of power devicesFENG TAO·Filed 2007·Application pending·0 cites
- 2039US2013243099A1Method for h264 transcoding with code stream information reuseFENG TAO·Filed 2010·Application pending·0 cites
- 2138US2012326300A1Low profile package and methodFENG TAO·Filed 2011·Application pending·0 cites
- 2237US2013235155A1Method of converting 2d into 3d based on image motion informationFENG TAO·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when FENG TAO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →