Assignee
FCM CO LTD
JP·2 granted patents·3 pending applications·23 citations·filing 2000–2009
Top patents by PatentIndex Score
5 records- 0172US6603205B2Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic componentsFCM CO LTD·Filed 2000·Granted Aug 5, 2003·21 cites·6 claims
- 0258US7563353B2Method of forming Sn-Ag-Cu ternary alloy thin-film on base materialFCM CO LTD·Filed 2005·Granted Jul 21, 2009·2 cites·11 claims
- 0348US2009188700A1Electrode substrate having conductive layers with different properties made of conductive materials with different properties formed on transparent base materialFCM CO LTD·Filed 2009·Application pending·0 cites
- 0445US2005123784A1Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the sameFCM CO LTD·Filed 2004·Application pending·0 cites
- 0544US2006240272A1Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereonFCM CO LTD·Filed 2003·Application pending·0 cites
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