Assignee
EVANA TECH UAB
LT·3 granted patents·5 citations·filing 2014–2016
Top patents by PatentIndex Score
3 records- 0171US11253955B2Multi-segment focusing lens and the laser processing for wafer dicing or cuttingEVANA TECH UAB·Filed 2016·Granted Feb 22, 2022·2 cites·18 claims
- 0260US10074565B2Method of laser processing for substrate cleaving or dicing through forming “spike-like” shaped damage structuresEVANA TECH UAB·Filed 2014·Granted Sep 11, 2018·2 cites·14 claims
- 0352US10916461B2Method of laser scribing of semiconductor workpiece using divided laser beamsEVANA TECH UAB·Filed 2015·Granted Feb 9, 2021·1 cites·9 claims
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