Assignee
EUN HYUNG-LAE
KR·2 granted patents·14 citations·filing 2010–2016
Top patents by PatentIndex Score
2 records- 0185US8436455B2Stacked structure of semiconductor packages including through-silicon via and inter-package connector, and method of fabricating the sameEUN HYUNG-LAE·Filed 2010·Granted May 7, 2013·14 cites·19 claims
- 0247US9761563B2Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the sameEUN HYUNG-LAE·Filed 2016·Granted Sep 12, 2017·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when EUN HYUNG-LAE files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →