Assignee
EUN HYUNG-IAE
KR·2 granted patents·57 citations·filing 2007–2013
Top patents by PatentIndex Score
2 records- 0188US8395259B2Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the sameEUN HYUNG-IAE·Filed 2007·Granted Mar 12, 2013·55 cites·17 claims
- 0263US9397034B2Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the sameEUN HYUNG-IAE·Filed 2013·Granted Jul 19, 2016·2 cites·20 claims
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