Assignee
ESEC TRADING SA
CH·38 granted patents·2 pending applications·291 citations·filing 2000–2004
Top patents by PatentIndex Score
40 records- 0184US6935539B2Device for the metered delivery of a viscous liquidESEC TRADING SA·Filed 2003·Granted Aug 30, 2005·23 cites·20 claims
- 0283US6705845B2Device for the metered delivery of a viscous liquidESEC TRADING SA·Filed 2002·Granted Mar 16, 2004·22 cites·16 claims
- 0370US6471110B1Method and apparatus for mounting semiconductor chipsESEC TRADING SA·Filed 2000·Granted Oct 29, 2002·25 cites·8 claims
- 0470US6460751B1Bondhead for a wire bonderESEC TRADING SA·Filed 2000·Granted Oct 8, 2002·23 cites·22 claims
- 0569US6293317B1Method and device for the application of a liquid substanceESEC TRADING SA·Filed 2000·Granted Sep 25, 2001·22 cites·14 claims
- 0667US6519840B1Apparatus and method for mounting semiconductor chips on a substrateESEC TRADING SA·Filed 2000·Granted Feb 18, 2003·13 cites·11 claims
- 0763US7146718B2Apparatus for mounting semiconductorsESEC TRADING SA·Filed 2004·Granted Dec 12, 2006·13 cites·6 claims
- 0862US7120995B2Apparatus for mounting semiconductorsESEC TRADING SA·Filed 2004·Granted Oct 17, 2006·10 cites·4 claims
- 0961US6516990B2Apparatus for making wire connectionsESEC TRADING SA·Filed 2001·Granted Feb 11, 2003·18 cites·5 claims
- 1059US6648205B2Method for the calibration of a wire bonderESEC TRADING SA·Filed 2002·Granted Nov 18, 2003·12 cites·12 claims
- 1157US6675465B2Pick-up toolESEC TRADING SA·Filed 2001·Granted Jan 13, 2004·7 cites·24 claims
- 1254US6929168B2Method for determining optimum bonding parameters for bonding with a wire bonderESEC TRADING SA·Filed 2003·Granted Aug 16, 2005·9 cites·10 claims
- 1354US6581436B2Pressure sensor with means for re-calibrationESEC TRADING SA·Filed 2002·Granted Jun 24, 2003·8 cites·6 claims
- 1454US6435492B1Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrateESEC TRADING SA·Filed 2000·Granted Aug 20, 2002·10 cites·4 claims
- 1553US6821375B2Method and apparatus for mounting semiconductor chips onto a flexible substrateESEC TRADING SA·Filed 2001·Granted Nov 23, 2004·8 cites·20 claims
- 1652US6648215B2Method and apparatus for mounting semiconductor chipsESEC TRADING SA·Filed 2001·Granted Nov 18, 2003·10 cites·6 claims
- 1751US7020954B2Apparatus for placing a semiconductor chip as a flipchip on a substrateESEC TRADING SA·Filed 2002·Granted Apr 4, 2006·5 cites·20 claims
- 1849US7284318B2Apparatus for mounting semiconductor chipsESEC TRADING SA·Filed 2002·Granted Oct 23, 2007·5 cites·12 claims
- 1948US7159751B2Wire bonderESEC TRADING SA·Filed 2004·Granted Jan 9, 2007·5 cites·6 claims
- 2048US6857554B2Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonderESEC TRADING SA·Filed 2003·Granted Feb 22, 2005·5 cites·2 claims
- 2148US6739496B2Method for the calibration of a wire bonderESEC TRADING SA·Filed 2003·Granted May 25, 2004·4 cites·18 claims
- 2247US7004372B2Method for determining optimum bond parameters when bonding with a wire bonderESEC TRADING SA·Filed 2003·Granted Feb 28, 2006·4 cites·4 claims
- 2346US6839958B2Apparatus for mounting semiconductor chipsESEC TRADING SA·Filed 2001·Granted Jan 11, 2005·3 cites·22 claims
- 2446US6530146B2Apparatus for mounting a flipchip on a work pieceESEC TRADING SA·Filed 2001·Granted Mar 11, 2003·3 cites·8 claims
- 2545US6481614B2Apparatus for mounting semiconductor chips on a substrateESEC TRADING SA·Filed 2001·Granted Nov 19, 2002·4 cites·21 claims
- 2644US6681797B2Pressure transducerESEC TRADING SA·Filed 2002·Granted Jan 27, 2004·4 cites·12 claims
- 2742US7080771B2Method for checking the quality of a wedge bondESEC TRADING SA·Filed 2004·Granted Jul 25, 2006·2 cites·2 claims
- 2842US6739493B2Device with an electrode for the formation of a ball at the end of a wireESEC TRADING SA·Filed 2003·Granted May 25, 2004·3 cites·4 claims
- 2941US6691574B2Method and device for measuring the amplitude of a freely oscillating capillary of a wire bonderESEC TRADING SA·Filed 2003·Granted Feb 17, 2004·2 cites·4 claims
- 3040US6993986B2Clamping element with an integrated force sensorESEC TRADING SA·Filed 2003·Granted Feb 7, 2006·1 cites·12 claims
- 3140US6820793B2Apparatus for the transport and equipping of substrates with semiconductor chipsESEC TRADING SA·Filed 2002·Granted Nov 23, 2004·1 cites·6 claims
- 3238US6811074B2Method and apparatus for dispensing solder on a substrateESEC TRADING SA·Filed 2003·Granted Nov 2, 2004·3 cites·5 claims
- 3338US6571461B2Linear guide with an air bearing having provision for heating a support element of the linear guide to maintain fluid gapESEC TRADING SA·Filed 2001·Granted Jun 3, 2003·2 cites·16 claims
- 3437US6739494B2Device with electrodes for the formation of a ball at the end of a wireESEC TRADING SA·Filed 2003·Granted May 25, 2004·0 cites·2 claims
- 3536US6585145B2Die bonder and/or wire bonder with a device for holding down a substrateESEC TRADING SA·Filed 2001·Granted Jul 1, 2003·1 cites·4 claims
- 3636US2005029328A1Method for checking the quality of a wedge bondESEC TRADING SA·Filed 2004·Application pending·0 cites
- 3734US6931932B2Device for measuring the amplitude of the tip of an oscillating capillaryESEC TRADING SA·Filed 2003·Granted Aug 23, 2005·0 cites·4 claims
- 3833US6898481B2Apparatus for mounting semiconductor chipsESEC TRADING SA·Filed 2003·Granted May 24, 2005·0 cites·8 claims
- 3932US7108167B2Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and methodESEC TRADING SA·Filed 2004·Granted Sep 19, 2006·1 cites·3 claims
- 4032US2004182912A1Wire bonderESEC TRADING SA·Filed 2004·Application pending·0 cites
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