Assignee
EPOXY TECHNOLOGY INC
US·6 granted patents·986 citations·filing 1979–1995
Top patents by PatentIndex Score
6 records- 0198US5196371AFlip chip bonding method using electrically conductive polymer bumpsEPOXY TECHNOLOGY INC·Filed 1991·Granted Mar 23, 1993·251 cites·19 claims
- 0298US5074947AFlip chip technology using electrically conductive polymers and dielectricsEPOXY TECHNOLOGY INC·Filed 1989·Granted Dec 24, 1991·260 cites·16 claims
- 0397US5611140AMethod of forming electrically conductive polymer interconnects on electrical substratesEPOXY TECHNOLOGY INC·Filed 1995·Granted Mar 18, 1997·201 cites·2 claims
- 0497US5237130AFlip chip technology using electrically conductive polymers and dielectricsEPOXY TECHNOLOGY INC·Filed 1991·Granted Aug 17, 1993·207 cites·18 claims
- 0580US4272926AFace finishing tool for fiber optic communication cableEPOXY TECHNOLOGY INC·Filed 1979·Granted Jun 16, 1981·33 cites·7 claims
- 0675US4637197AMethod and compositions for removal of moistureEPOXY TECHNOLOGY INC·Filed 1985·Granted Jan 20, 1987·34 cites·22 claims
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