Assignee
ENGELHARDT MANFRED
DE·11 granted patents·5 pending applications·22 citations·filing 2006–2012
Top patents by PatentIndex Score
16 records- 0183US8338317B2Method for processing a semiconductor wafer or die, and particle deposition deviceENGELHARDT MANFRED·Filed 2011·Granted Dec 25, 2012·7 cites·19 claims
- 0279US8093637B2MIM capacitor and associated production methodENGELHARDT MANFRED·Filed 2006·Granted Jan 10, 2012·8 cites·23 claims
- 0374US8906782B2Method of separating semiconductor die using material modificationENGELHARDT MANFRED·Filed 2012·Granted Dec 9, 2014·3 cites·15 claims
- 0468US8877631B2Interconnect arrangement and associated production methodsENGELHARDT MANFRED·Filed 2011·Granted Nov 4, 2014·2 cites·10 claims
- 0566US9530618B2Plasma system, chuck and method of making a semiconductor deviceENGELHARDT MANFRED·Filed 2012·Granted Dec 27, 2016·1 cites·20 claims
- 0666US8575026B2Method of protecting sidewall surfaces of a semiconductor substrateENGELHARDT MANFRED·Filed 2011·Granted Nov 5, 2013·1 cites·20 claims
- 0751US9030744B2Fabrication of micro lensesENGELHARDT MANFRED·Filed 2011·Granted May 12, 2015·0 cites·25 claims
- 0848US8993437B2Method for etching substrateENGELHARDT MANFRED·Filed 2011·Granted Mar 31, 2015·0 cites·41 claims
- 0948US2013137273A1Semiconductor Processing SystemENGELHARDT MANFRED·Filed 2011·Application pending·0 cites
- 1046US2006199368A1Interconnect arrangement and associated production methodsENGELHARDT MANFRED·Filed 2006·Application pending·0 cites
- 1145US8709906B2MIM capacitor and associated production methodENGELHARDT MANFRED·Filed 2012·Granted Apr 29, 2014·0 cites·7 claims
- 1244US8772133B2Utilization of a metallization scheme as an etching maskENGELHARDT MANFRED·Filed 2012·Granted Jul 8, 2014·0 cites·14 claims
- 1343US8877610B2Method of patterning a substrateENGELHARDT MANFRED·Filed 2011·Granted Nov 4, 2014·0 cites·24 claims
- 1439US2013098390A1Device for processing a carrier and a method for processing a carrierENGELHARDT MANFRED·Filed 2011·Application pending·0 cites
- 1539US2007218677A1Method of Forming Self-Aligned Air-Gaps Using Self-Aligned Capping Layer over Interconnect LinesENGELHARDT MANFRED·Filed 2006·Application pending·0 cites
- 1637US2013115757A1Method for separating a plurality of dies and a processing device for separating a plurality of diesENGELHARDT MANFRED·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →