Assignee
EMESH ISMAIL
US·1 granted patent·4 pending applications·1 citations·filing 2004–2007
Top patents by PatentIndex Score
5 records- 0158US8268135B2Method and apparatus for electrochemical planarization of a workpieceEMESH ISMAIL·Filed 2005·Granted Sep 18, 2012·1 cites·10 claims
- 0249US2008237048A1Method and apparatus for selective electrofilling of through-wafer viasEMESH ISMAIL·Filed 2007·Application pending·0 cites
- 0343US2006003566A1Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnectsEMESH ISMAIL·Filed 2004·Application pending·0 cites
- 0436US2007017818A1Solution for electrochemical mechanical polishingEMESH ISMAIL·Filed 2005·Application pending·0 cites
- 0536US2007111523A1Process for conditioning conductive surfaces after electropolishingEMESH ISMAIL·Filed 2005·Application pending·0 cites
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