Assignee
EAGLESTONE PARTNERS I LLC
US·18 granted patents·437 citations·filing 1999–2004
Top patents by PatentIndex Score
18 records- 0194US6524885B2Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniquesEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Feb 25, 2003·64 cites·11 claims
- 0286US6815712B1Method for selecting components for a matched set from a wafer-interposer assemblyEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Nov 9, 2004·34 cites·38 claims
- 0383US6440771B1Method for constructing a wafer interposer by using conductive columnsEAGLESTONE PARTNERS I LLC·Filed 2001·Granted Aug 27, 2002·30 cites·24 claims
- 0482US6537831B1Method for selecting components for a matched set using a multi wafer interposerEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Mar 25, 2003·31 cites·37 claims
- 0579US6967494B2Wafer-interposer assemblyEAGLESTONE PARTNERS I LLC·Filed 2004·Granted Nov 22, 2005·24 cites·24 claims
- 0679US6673653B2Wafer-interposer using a ceramic substrateEAGLESTONE PARTNERS I LLC·Filed 2001·Granted Jan 6, 2004·29 cites·31 claims
- 0779US6483043B1Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chipEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Nov 19, 2002·30 cites·32 claims
- 0879US6483330B1Method for selecting components for a matched set using wafer interposersEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Nov 19, 2002·24 cites·42 claims
- 0977US6759741B2Matched set of integrated circuit chips selected from a multi wafer-interposerEAGLESTONE PARTNERS I LLC·Filed 2003·Granted Jul 6, 2004·22 cites·30 claims
- 1074US6812048B1Method for manufacturing a wafer-interposer assemblyEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Nov 2, 2004·19 cites·17 claims
- 1172US6933617B2Wafer interposer assemblyEAGLESTONE PARTNERS I LLC·Filed 2003·Granted Aug 23, 2005·13 cites·29 claims
- 1272US6686657B1Interposer for improved handling of semiconductor wafers and method of use of sameEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Feb 3, 2004·16 cites·25 claims
- 1371US6927083B2Method for constructing a wafer-interposer assemblyEAGLESTONE PARTNERS I LLC·Filed 2004·Granted Aug 9, 2005·15 cites·26 claims
- 1465US6392428B1Wafer level interposerEAGLESTONE PARTNERS I LLC·Filed 1999·Granted May 21, 2002·34 cites·7 claims
- 1563US6822469B1Method for testing multiple semiconductor wafersEAGLESTONE PARTNERS I LLC·Filed 2000·Granted Nov 23, 2004·29 cites·12 claims
- 1658US6825678B2Wafer level interposerEAGLESTONE PARTNERS I LLC·Filed 2002·Granted Nov 30, 2004·7 cites·29 claims
- 1753US6927593B2System for testing semiconductor die on multiple semiconductor wafersEAGLESTONE PARTNERS I LLC·Filed 2004·Granted Aug 9, 2005·13 cites·29 claims
- 1849US7036218B2Method for producing a wafer interposer for use in a wafer interposer assemblyEAGLESTONE PARTNERS I LLC·Filed 2003·Granted May 2, 2006·3 cites·22 claims
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