Assignee
DEXTER ELECTRONIC MATERIALS DI
US·2 granted patents·9 citations·filing 1990–1991
Top patents by PatentIndex Score
2 records- 0135US5104604AFlame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compoundDEXTER ELECTRONIC MATERIALS DI·Filed 1990·Granted Apr 14, 1992·8 cites·23 claims
- 0227US5338781AFlame retardant epoxy molding compound for encapsulating a semiconductor deviceDEXTER ELECTRONIC MATERIALS DI·Filed 1991·Granted Aug 16, 1994·1 cites·18 claims
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